Fifth generation or 5G is the latest upgrade in cellular technology which promises not only faster data transfer speeds but also low latency and ability to connect many more devices simultaneously. As 5G networks continue to roll out across the world, the underlying 5G chipsets powering user devices and infrastructure are becoming increasingly important. These system on chips (SoCs) integrate multiple components needed for 5G connectivity and functionality into a single package.

Key Vendors

Qualcomm: As one of the largest mobile chipset developers, Qualcomm has introduced several 5G integrated circuits including the Snapdragon X55, X60 and X65 models. These multi-mode 5G SoCs support both sub-6GHz and mmWave spectrums and are found in many flagship Android smartphones.

Huawei: Huawei's HiSilicon division produces powerful Kirin 5G chipsets like the Kirin 990 used in top-tier Huawei phones. However, ongoing trade restrictions limit their availability outside of China.

Samsung: The Exynos 980 and Exynos 2100 are Samsung's 5G-integrated SoCs competing with Snapdragon chips. They power select Galaxy smartphones and tablets.

MediaTek: MediaTek Dimensity 800, 1000 and 1200 systems-on-chips offer affordable 5G connectivity targeting mid-range devices.

UNISOC: As a Chinese fabless chip designer, UNISOC provides cost-effective 5G modem solutions under the Tiger, T75 and T310 brands.

Intel: After exiting the smartphone modem business, Intel focuses on 5G infrastructure with solutions like the Miche internet computing platforms.

Key Technologies

Multi-mode Support: Flagship 5G chipsets support both sub-6GHz and mmWave spectrums to maximize coverage. They also maintain compatibility with older network technologies.

Integrated Modems: Modem and radio frequency transceiver functions are integrated onto the SoC along with application processors for reduced size and power consumption.

AI Processing: Neural network accelerators on newer 5G chips power on-device AI features like computer vision, natural language processing etc.

MmWave RF Design: For mmWave 5G networks in high frequencies like 28GHz and 39GHz, chipsets require novel RF designs with beamforming antennas and adaptive beam-steering.

Multi-Gigabit Throughout: Advanced channel coding, carrier aggregation techniques and support for wide channel bandwidths allow 5G chipsets to deliver theoretical speeds exceeding 1Gbps.

Massive MIMO: Array processors handle complex calculations for large scale antenna technologies like massive MIMO used in5G base stations for multi-user MIMO gains.

URLLC Support: Ultra-reliable low latency communications required for mission critical services depend on features like shortened TTI lengths supported by 5G SoCs.

Open RAN Friendly: Major vendors, except Huawei, design multi-vendor compatible 5G chipsets for the evolving open and virtualized RAN ecosystem.

Extending Connectivity to New Devices

5G chipsets go beyond powering smartphones to enable new categories of connected devices. Their low-latency and high-bandwidth capabilities are ideal for Internet of Things (IoT) applications requiring real-time connectivity:

Industrial IoT: Industrial automation systems benefit from the determinism and reliability of 5G for machine-type communications. Sensors and machines in manufacturing plants can be 5G-integrated.

Automotive: Chipsets allow enhanced telematics, infotainment, and support for technologies like vehicle-to-everything (V2X) communications. Over-the-air software updates are possible through built-in 5G modems.

AR/VR Headsets: Standalone augmented and virtual reality headsets rely on integrated 5G modems to wirelessly access high fidelity interactive content without a companion device.

Drones: Beyond basic drone telemetry, professional and industrial drones can stream live ultra-high definition video over 5G to operators on the ground with minimal latency using modem-equipped drones.

Smart Cities: Municipal networks powered by 5G facilitate advanced applications for connected vehicles, environmental monitoring sensors, public safety devices and more.

 
As 5G deployment accelerates and more spectrum bands are allocated for cellular usage, future generations of them will see continued performance improvements. Chipsets integrated with 6G technology when available will provide even higher speeds and lower latency suitable for mission critical/tactile internet services. Multi-chip module form factors combining modem, RF and baseband processing onto separate interposer-based dies will push integration further. Edge AI/ML capabilities will be more tightly coupled with 5G connectivity. And technologies like super mmWave will necessitate novel MMIC and RFIC designs to achieve terabit speeds in upper millimeter wave bands. Overall, 5G chipsets form the core of a new digital infrastructure enabling advanced wireless applications across every industry.

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About Author:
Money Singh is a seasoned content writer with over four years of experience in the market research sector. Her expertise spans various industries, including food and beverages, biotechnology, chemical and materials, defense and aerospace, consumer goods, etc. (https://www.linkedin.com/in/money-singh-590844163)