After PCB prototype manufacturer hand over the work of smt patch proofing to smt patch manufacturers, it does not mean that they have nothing to do. On the contrary, in order to ensure that the product has no problems and will not affect the performance of electronic products, electronic manufacturers must learn to identify the qualified standards of smt patch proofing, so as to avoid receiving defective products. So, what are the criteria for judging the qualified smt patch proofing?

1. There must be a reliable electrical connection on the PCB light board:
When a virtual solder or a small amount of alloy layer is formed on the surface of the component, it is difficult to find this situation during testing or initial work. However, as the use time increases, after the contact layer is completely oxidized, it is easy to peel off. Welding, the circuit breaks and turns on, does not work, etc. At this time, visually inspect the appearance of the circuit board, the circuit is connected, but it cannot work normally. This is a very troublesome problem in smt patch proofing, and it is also a situation that manufacturers will deal with carefully. In order to solve this problem, smt patch proofing will ensure a reliable electrical connection during the manufacturing process, which can greatly reduce the occurrence of this situation.

2. The appearance of the solder joints of the PCB light board:

A good quality PCB board must have a clean, smooth and metallic luster on the surface of the solder joints. If dirt or residue appears, it may have a certain impact on electronic products, such as easy leakage and frequent short circuits. This is a problem that often occurred in the early stage of mobile phone electronic products, but in the later stage, with the emergence of smt patch technology, this phenomenon has slowly disappeared. However, if the company does not know this, this problem may also arise.

In addition, to judge whether the SMT PCB light board is qualified, it depends on whether there are burrs, gaps, and tin drag on the surface. If there is, it will affect the beauty of smt patch proofing, and it will also bring other hazards, especially in high voltage electricity. During construction, tip discharge may occur, causing damage to electronic products. The surface of the PCB bare board solder joints must also be guaranteed to be free of abnormalities, otherwise it is easy to cause false soldering, false soldering, and unreliable smt patch proofing. This is well known by experienced masters.